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Letzte Einträge:
2014-10-14
14:48
Silicon micro-strip ladders: / Bergauer, T. (OEAW)
AIDA-NOTE-2014-003.- Geneva : CERN, 2014 Fulltext: PDF;

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2014-10-14
13:46
Silicon micro-strip ladders: / Bergauer, T. (OEAW)
AIDA-D9.5.- Geneva : CERN, 2014 AIDA, 9.5 Fulltext: 5.PDF;

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2014-10-07
14:32
Commissioning tests of the AIDA telescope / Rubinsky, I. (DESY)
AIDA-MISC-2014-006.- Geneva : CERN, 2014 Fulltext: PDF;

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2014-09-30
15:24
Upgrade scenarios for irradiation lines: : Upgrade of the Proton Irradiation Facility in the CERN PS EAST AREA / Ravotti, F. (CERN) ; Glaser, M. (CERN) ; Moll, M. (CERN)
AIDA-D8.4.- Geneva : CERN, 2014 AIDA, 8.4 Fulltext: 4.PDF;

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2014-09-25
13:16
Particle Flow software tools / Thomson, M. (UCAM)
AIDA-D2.9.- Geneva : CERN, 2014 AIDA, 2.9 Fulltext: PDF;

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2014-09-25
11:26
Alignment tools software tools / Borghi, S. (UNIMAN) ; Hombach, C. (UNIMAN) ; Parkes, C. (UNIMAN)
AIDA-D2.10.- Geneva : CERN, 2014 AIDA, 2.10 Fulltext: PDF;

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2014-09-25
10:38
1st set of macro blocks / Re, V. (INFN)
AIDA-D3.4.- Geneva : CERN, 2014 AIDA, 3.4 Fulltext: 4.PDF;

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2014-09-24
11:04
Overal industry relation report / Le Goff, J.-M. (CERN)
AIDA-D4.1.- Geneva : CERN, 2014 AIDA, 4.1 Fulltext: 1.PDF;

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2014-07-09
10:06
A fast, low-power, 6-bit SAR ADC for readout of strip detectors in the LHCb Upgrade experiment. / Firlej,M (AGH) ; Fiutowski,M (AGH) ; Idzik,M (AGH) ; Moron,J (AGH) ; Swientek,K (AGH)
The readout of silicon strip sensors in the upgraded Tracker System of Large Hadron Collider beauty (LHCb) experiment will require a novel complex Application Specific Integrated Circuit (ASIC). The ASIC will extract and digitise analogue signal from the sensor and subsequently will perform digital processing and serial data transmission. [...]
AIDA-PUB-2014-008.- Geneva : CERN, 2014 - Published in : Journal of Instrumentation (2014) Fulltext: PDF;

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2014-06-20
15:06
Detectors in 3D available for assessment / Re, Valerio (INFN)
This deliverable reports on 3D devices resulting from the vertical integration of pixel sensors and readout electronics. After 3D integration steps such as etching of through-silicon vias and backside metallization of readout integrated circuits, ASICs and sensors are interconnected to form a 3D pixel detector. [...]
AIDA-D3.8.- Geneva : CERN, 2014 AIDA, 3.8 Fulltext: PDF;

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AIDA (Advanced European Infrastructures for Detectors at Accelerators) is co-funded by the European Commission within the Framework Programme 7 Capacities Specific Programme, under Grant Agreement no. 262025. Project website: http://cern.ch/aida.