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A fast, low-power, 6-bit SAR ADC for readout of strip detectors in the LHCb Upgrade experiment. / Firlej,M (AGH) ; Fiutowski,M (AGH) ; Idzik,M (AGH) ; Moron,J (AGH) ; Swientek,K (AGH)
The readout of silicon strip sensors in the upgraded Tracker System of Large Hadron Collider beauty (LHCb) experiment will require a novel complex Application Specific Integrated Circuit (ASIC). The ASIC will extract and digitise analogue signal from the sensor and subsequently will perform digital processing and serial data transmission. [...]
AIDA-PUB-2014-008.- Geneva : CERN, 2014 - Published in : Journal of Instrumentation (2014) Fulltext: PDF;

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Detectors in 3D available for assessment / Re, Valerio (INFN)
This deliverable reports on 3D devices resulting from the vertical integration of pixel sensors and readout electronics. After 3D integration steps such as etching of through-silicon vias and backside metallization of readout integrated circuits, ASICs and sensors are interconnected to form a 3D pixel detector. [...]
AIDA-D3.8.- Geneva : CERN, 2014 AIDA, 3.8 Fulltext: PDF;

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Characterization of the Gain Dependence on Temperature in Silicon Photomultipliers / Cvach, J (ASCR) ; Eigen, G (UiB) ; Kvasnicka, J (ASCR) ; Polak, I (ASCR) ; Van der Kraaij, E (UiB) ; Zalieckas, J (UiB)
We present a study of the gain dependence on temperature in several different silicon photomultipliers. This work was motivated by the goal to determine design options for an power supply regulator that has the capability to adjust the bias voltage with changing temperature to keep the gain constant. [...]
AIDA-NOTE-2014-002.- Geneva : CERN, 2014 Fulltext: PDF;

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AIDA Alignment package user guide / Borghi, Silvia (UNIMAN) ; Hombach, Christoph (UNIMAN) ; Parkes, Chris (UNIMAN)
AIDA-NOTE-2014-001.- Geneva : CERN, 2014 Fulltext: PDF;

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2nd Periodic Report Public version
AIDA-D1.3.- Geneva : CERN, 2014 AIDA, 1.3 Fulltext: PDF;

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Recent results of the ATLAS Upgrade Planar Pixel Sensors R&D Project / Marchiori,G (LPNHE)
The ATLAS detector has to undergo significant updates at the end of the current decade, in order to withstand the increased occupancy and radiation damage that will be produced by the highluminosity upgrade of the Large Hadron Collider. In this presentation we give an overview of the recent accomplishments of the R&D; activity on the planar pixel sensors for the ATLAS Inner Detector upgrade..
AIDA-CONF-2014-017.- Geneva : CERN, 2014 Fulltext: PDF;
In : 10th International Conference on Large Scale Applications and Radiation Hardness of Semiconductor Detectors, Florence, Italy, 6 - 8 Jul 2011

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The Air Microwave Yield (AMY) experiment-A laboratory measurement of the microwave emission from extensive air showers / Louedec,K (LPSC) ; Alvarez-Muñiz,J (USC) ; Blanco,M (LPNHE) ; Bohácová,M (FZU) ; Buonomo,B (INFN) ; Cataldi,G (INFN) ; Coluccia,MR (INFN, UNISalento) ; Creti,P (INFN) ; De Mitri,I (INFN, UNISalento) ; Di Giulio,C (INFN) et al.
The AMY experiment aims to measure the microwave bremsstrahlung radiation (MBR) emitted by air-showers secondary electrons accelerating in collisions with neutral molecules of the atmosphere. The measurements are performed using a beam of 510 MeV electrons at the Beam Test Facility (BTF) of Frascati INFN National Laboratories. The goal of the AMY experiment is to measure in laboratory conditions the yield and the spectrum of the GHz emission in the frequency range between 1 and 20 GHz. [...]
AIDA-CONF-2014-016.- Geneva : CERN, 2014 Fulltext: PDF;
In : EPS-HEP 2013 European Physical Society Conference on High Energy Physics, Stockholm, Sweden, 18 - 24 Jul 2013

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AIDA-MISC-2014-005.- Geneva : CERN, 2014 Fulltext: PDF;

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SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades / Macchiolo, A (Munich, Max Planck Inst.) ; Andricek, L (Munich, Max Planck Inst.) ; Moser, H G (Munich, Max Planck Inst.) ; Nisius, R (Munich, Max Planck Inst.) ; Richter, R H (Munich, Max Planck Inst.) ; Weigell, P (Munich, Max Planck Inst.)
We present the results of the characterization of pixel modules composed of 75 μm thick n-in-p sensors and ATLAS FE-I3 chips, interconnected with the SLID (Solid Liquid Inter-Diffusion) technology. This technique, developed at Fraunhofer-EMFT, is explored as an alternative to the bump-bonding process. [...]
AIDA-CONF-2014-015.- Geneva : CERN, 2014 Fulltext: PDF;
In : 2nd International Conference on Technology and Instrumentation in Particle Physics, Chicago, IL, USA, 9 - 14 Jun 2011

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Characterization of Thin Pixel Sensor Modules Interconnected with SLID Technology Irradiated to a Fluence of 2⋅10 15 \,n eq /cm 2 / Weigell,P (MPI) ; Andricek,L (MPI) ; Beimforde,M (MPI) ; Macchiolo,A (MPI) ; Moser,H.G (MPI) ; Nisius,R (MPI) ; Richter,R.H (MPI)
A new module concept for future ATLAS pixel detector upgrades is presented, where thin n-in-p silicon sensors are connected to the front-end chip exploiting the novel Solid Liquid Interdiffusion technique (SLID) and the signals are read out via Inter Chip Vias (ICV) etched through the front-end. This should serve as a proof of principle for future four-side buttable pixel assemblies for the ATLAS upgrades, without the cantilever presently needed in the chip for the wire bonding. [...]
AIDA-PUB-2011-011.- Geneva : CERN, 2011 - Published in : JINST: 6 (2011) , no. C12049 Fulltext: PDF;

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AIDA (Advanced European Infrastructures for Detectors at Accelerators) is co-funded by the European Commission within the Framework Programme 7 Capacities Specific Programme, under Grant Agreement no. 262025. Project website: