2025-07-19 09:21 |
Transient simulations of MAPS using TCAD, Allpix squared & SPICE
/ Mendes, Larissa (DESY) ; Dannheim, Dominik (CERN) ; Del Rio Viera, Manuel (DESY) ; Dort, Katharina (CERN) ; Eckstein, Doris (DESY) ; King, Finn (DESY) ; Gregor, Ingrid-Maria (DESY) ; He, Yajun (DESY) ; Huth, Lennart (DESY) ; Lachnit, Stephan (DESY) et al.
Monolithic Active Pixel Sensors (MAPS) designed in a 65 nm CMOS imaging technology are an alternative to hybrid pixel sensors as they eliminate the demand for flip-chip bonding while reducing material budget through thinner active sensor layers. The TANGERINE project aims to create a 65 nm MAPS sensor with a small collection electrode for use in future lepton colliders and beam telescopes. [...]
2025 - 4 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 1080 (2025) 170749
In : 17th Vienna Conference on Instrumentation (VCI2025), Vienna, Austria, 17 - 21 Feb 2025, pp.170749
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2025-07-19 09:21 |
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2025-07-19 09:21 |
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2025-07-18 06:06 |
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2025-07-18 06:06 |
Simulation of CMOS strip sensors
/ Davis, Naomi (DESY) ; Arling, Jan-Hendrik (DESY) ; Baselga, Marta (Dortmund U.) ; Diehl, Leena (Freiburg U. ; CERN) ; Dingfelder, Jochen (Bonn U.) ; Gregor, Ingrid-Maria (DESY) ; Hauser, Marc (Freiburg U.) ; Hügging, Fabian (Bonn U.) ; Jakobs, Karl (Freiburg U.) ; Karagounis, Michael (Applied Sci. U., Dortmund) et al.
In high-energy physics, there is a need to investigate silicon sensor concepts that offer large-area coverage and cost-efficiency for particle tracking detectors. Sensors based on CMOS imaging technology present a promising alternative silicon sensor concept. [...]
2025 - 5 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 1080 (2025) 170807
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2025-07-18 06:06 |
Characterization of the FBK-LGAD devices manufactured at an external foundry for large-volume productions
/ CMS Collaboration
In recent years, the HEP detector community has shown an increasing interest in Low Gain Avalanche Diodes (LGADs) due to their excellent temporal resolution, good radiation resistance, and low material budget. An example of this is the upcoming CMS Endcap Timing Layer (ETL), a subdetector which will feature four disks (14 m$^{2}$) covered with these devices.In this context, Fondazione Bruno Kessler (FBK), one of the qualified producers of the ETL LGAD sensors, has recently initiated a technology transfer of the FBK-LGAD technology to an external CMOS foundry (LFoundry) in order to enable a larger and cost-effective production.The first prototype run from LFoundry was produced in May 2024. [...]
2025 - 9 p.
- Published in : JINST 20 (2025) C07039
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2025-07-18 06:06 |
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2025-07-18 06:05 |
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2025-07-18 06:05 |
Quantifying the Heat Load to Conductors Due to Strain Energy Release in CTD-101 K Magnet Impregnant
/ van Steenlandt, Jan (Twente U., Enschede) ; Kario, Anna (Twente U., Enschede) ; Otten, Simon (Twente U., Enschede) ; Warnet, Laurent (Twente U., Enschede) ; Wessel, Sander (Twente U., Enschede) ; ten Kate, Herman (Twente U., Enschede) ; van Oort, Hans (Twente U., Enschede)
State-of-the-art Nb3Sn superconducting accelerator magnets are still prone to lengthy training. This study investigates whether direct heat from fractures in commonly used magnet impregnant is sufficient to cause the instabilities during training. [...]
2025 - 7 p.
- Published in : IEEE Trans. Appl. Supercond. 35 (2025) 1-7
document.pdf: PDF; External link: Fulltext
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2025-07-18 06:05 |
TCAD and charge transport simulations of MAPS in 65 nm for the ALICE ITS3
/ Sanna, I (Munich, Tech. U. ; CERN) ; Lemoine, C (CERN ; Strasbourg, IPHC) ; Borghello, G (CERN) ; Snoeys, W (CERN)
/ALICE Collaboration
As part of the upgrade to the Inner Tracking System 3 (ITS3) for ALICE and the strategicR&D; programme of the CERN EP department, stitched Monolithic Active Pixel Sensors (MAPS) arebeing developed using a 65 nm CMOS imaging process. Several sensor prototypes were characterizedin laboratory using radioactive sources, particularly the $^{55}$Fe source, which was extensivelyused. [...]
2025 - 7 p.
- Published in : JINST 20 (2025) C06032
Fulltext: PDF;
In : 11th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging (PIXEL 2024), Strasbourg, France, 18 - 22 Nov 2024, pp.C06032
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