CERN Accelerating science

 
Example of LVL1 distribution.
noimgRelevant quantities of the n-in-p samples.
Left: View of a corner of an n-in-p sensor of the CiS production with 15 guard rings. Right: View of a corner of an n-in-p sensor of the CiS production,with 19 guard rings.
Left: View of a corner of an n-in-p sensor of the CiS production with 15 guard rings. Right: View of a corner of an n-in-p sensor of the CiS production,with 19 guard rings.
Schematics of a CiS n-in-p pixel assembly. The potential of the different parts is given. The BCB layer is indicated in orange.
Relative cluster size abundance as a function of bias voltage for irradiated MPP4 and MPP5 devices. MPP3 (non-irradiated) are added for comparison. Particles were impinging at normal incidence. Errors on fractions are negligible and so not visible in the plot.
Charge collection within a single pixel by track position for MPP3 at $V_{\mathrm{bias}}$ of 150\,V
Charge collection within a single pixel by track position for MPP5 at $V_{\mathrm{bias}}=500$\,V
Charge collected in a cluster: most probable value of the charge distribution fitted to a Landau function convoluted with a gaussian as a function of the bias voltage. See text for the discussion on the assigned systematic uncertainty. The threshold value is also depicted as a dashed line.
Charge sharing map for MPP3 detector, biased at 150\,V (top) and for MPP4 detector, biased at 700\,V.
Charge sharing map for MPP3 detector, biased at 150\,V (top) and for MPP4 detector, biased at 700\,V.
Residual distribution for irradiated sample MPP5 at V$_{bias}$ of 500\,V. Left: long pixel projection; right: short pixel projection.
Residual distribution for irradiated sample MPP5 at V$_{bias}$ of 500\,V. Left: long pixel projection; right: short pixel projection.
Residual distribution for non-irradiated MPP3 biased at 150 Volts. Left: long pixel projection; right: short pixel projection.
Residual distribution for non-irradiated MPP3 biased at 150 Volts. Left: long pixel projection; right: short pixel projection.
Residual distribution for irradiated sample MPP5 biased at V$_{bias}$ of 500\,V, for two-hit clusters. Left: long pixel projection; right: short pixel projection.
Residual distribution for irradiated sample MPP5 biased at V$_{bias}$ of 500\,V, for two-hit clusters. Left: long pixel projection; right: short pixel projection.
Residual distribution for unirradiated sample MPP3 at V$_{bias}$ of 150\,V, for two-hit clusters. Analysis restricted to clusters with 2 pixels. Left: long pixel projection; right: short pixel projection.
Residual distribution for unirradiated sample MPP3 at V$_{bias}$ of 150\,V, for two-hit clusters. Analysis restricted to clusters with 2 pixels. Left: long pixel projection; right: short pixel projection.
Pixel cell design details for KEK1 (top) and KEK2 (bottom) samples.
Pixel cell design details for KEK1 (top) and KEK2 (bottom) samples.
Collected charge as a function of the bias voltage for HPK samples; particles were impinging at diffent angles too. A threshold of 3200\,e is indicated.
Collected charge as a function of the bias voltage for HPK samples; particles were impinging at diffent angles too. A threshold of 3200\,e is indicated.
Charge sharing map for KEK1 (top) and KEK2 (bottom) at V$_{bias}$ of 200\,V.
Fraction of cluster sizes as function of the bias voltage for HPK samples; particles were impinging at diffent angles too.
Charge sharing map for KEK1 (top) and KEK2 (bottom) at V$_{bias}$ of 200\,V.
Cluster position residual distribution for non-irradiated sample KEK1 at V$_{bias}$ of 200\,V at normal incidence. Left: long pixel projection; right: short pixel projection.
Cluster position residual distribution for non-irradiated sample KEK1 at V$_{bias}$ of 200\,V at normal incidence. Left: long pixel projection; right: short pixel projection.
Residual distribution for non-irradiated KEK1 biased at 200 Volts clusters with 2 pixels. Left: long pixel projection; right: short pixel projection.
Residual distribution for non-irradiated KEK1 biased at 200 Volts clusters with 2 pixels. Left: long pixel projection; right: short pixel projection.
Collected charge as a function of bias voltage for n-in-n samples irradiated to different fluences (see details in the text). A threshold of 3200~e is indicated.
Charge collection within a pixel. Top: DO9 at V$_{bias}$=1200\,V. Bottom: DO10 at V$_{bias}$=1000\,V.
Charge collection within a pixel. Top: DO9 at V$_{bias}$=1200\,V. Bottom: DO10 at V$_{bias}$=1000\,V.
Top: Design of the sample of the region shown in the plot below. Bottom: Charge sharing probability for DO9 at V$_{bias}$=1200V. Note the reduced charge sharing in the bias grid region on the right-hand side of the central pixel.
Top: Design of the sample of the region shown in the plot below. Bottom: Charge sharing probability for DO9 at V$_{bias}$=1200V. Note the reduced charge sharing in the bias grid region on the right-hand side of the central pixel.
Fractions of 1-, 2-, and 3-hit clusters as function of bias voltage for irradiated n-in-n samples; see text for details. Error bars are too small to be visible.
Residual distributions for 2-pixel clusters only. Shown are distributions samples irradiated to $5\times 10^{15}$\,n$_{\rm eq}$/cm$^2$ (left: DO9, bias voltage 1000\,V) and $2\times 10^{16}$\,n$_{\rm eq}$/cm$^2$ (right, DO10, bias voltage 1200\,V), respectively.
Residual distributions for 2-pixel clusters only. Shown are distributions samples irradiated to $5\times 10^{15}$\,n$_{\rm eq}$/cm$^2$ (left: DO9, bias voltage 1000\,V) and $2\times 10^{16}$\,n$_{\rm eq}$/cm$^2$ (right, DO10, bias voltage 1200\,V), respectively.
Residual distributions in the short pixel direction for an unirradiated sample (DO6, left) and a sample irradiated to $2\times 10^{16}$\,n$_{\rm eq}$/cm$^2$ operated at a bias voltage of 1000\,V (DO10, right). No deterioration of the spatial distribution with irradiation is visible.
Residual distributions in the short pixel direction for an unirradiated sample (DO6, left) and a sample irradiated to $2\times 10^{16}$\,n$_{\rm eq}$/cm$^2$ operated at a bias voltage of 1000\,V (DO10, right). No deterioration of the spatial distribution with irradiation is visible.
Test structures for slim edge studies. Top: DO6, the active pixel region overlaps the guard rings by 210\,$\mu$m. Bottom: DO3, groups of 10 pixels shifted towards the edge of the sensor in steps of 25\,$\mu$m.
Test structures for slim edge studies. Top: DO6, the active pixel region overlaps the guard rings by 210\,$\mu$m. Bottom: DO3, groups of 10 pixels shifted towards the edge of the sensor in steps of 25\,$\mu$m.
Charge collection in the pixels shifted underneath the guard rings.
Charge collection in the pixels shifted underneath the guard rings.