<?xml version="1.0" encoding="UTF-8"?>
<articles>
<article xmlns:xlink="http://www.w3.org/1999/xlink/">
  <front>
    <journal-meta>
      <journal-title>JINST</journal-title>
      <abbrev-journal-title>JINST</abbrev-journal-title>
      <issn/>
    </journal-meta>
    <article-meta>
      <title-group>
        <article-title>Hybrid circuits for the CMS tracker upgrade frontend electronics</article-title>
      </title-group>
      <contrib-group>
        <contrib contrib-type="author">
          <name>
            <surname>Blanchot</surname>
            <given-names>G</given-names>
          </name>
          <aff>
            <institution>CERN</institution>
          </aff>
        </contrib>
      </contrib-group>
      <pub-date pub-type="pub">
        <year>2013</year>
      </pub-date>
      <volume>8</volume>
      <fpage/>
      <lpage/>
      <self-uri xlink:href="http://cds.cern.ch/record/1608683"/>
      <self-uri xlink:href="http://cds.cern.ch/record/1608683/files/1748-0221_8_01_C01041.pdf"/>
    </article-meta>
    <abstract>The upgrade of the CMS tracker at the HL-LHC requires the design of new front-end modules to cope with the increased luminosity and to implement L1 trigger functionality. The new modules under development are based on high density hybrid circuits with new flip-chip front-end ASIC, and are wire bonded to strip sensors and connected to a service board for the data transmission. The suitability of different substrate technologies considered for the design of the hybrids is discussed, aiming for a cost effective and reliable manufacturability of the CMS tracker modules.</abstract>
  </front>
  <article-type>research-article</article-type>
  <ref/>
</article>

</articles>