Characterisation of strip silicon detectors for the ATLAS Phase-II Upgrade with a micro-focused X-ray beam
- Poley, Luise et al
- DESY-16-047arXiv:1603.04846
 | ABCN-25 end-cap module as operated in the test beam. The module (1), consisting of two sensors, connected by a hybrid with twelve readout chips, was mounted on a test frame with a connector for data readout (2), low voltage (3) to power the module, high voltage (4) to bias the sensor, cooling tubes (5) leading through the mounting jig and a vacuum line (6) for a good contact between module and cooling jig. The sensor strip orientation is shown in a magnified sensor area with wire bond connections between strips and readout channels. |
 | ABC130 mini module mounted on a test frame. The device consists of two miniature prototypes of ATLAS silicon strip sensors (1), a hybrid (2) with three ABC130 readout chips (3), wire bonded to the miniature sensors. The device is mounted on a test frame, providing power (4) and an interface to the readout electronics (5). The arrow indicates the sensor strip orientation. |
 | Beam width in x: {\unit[2.6]{$\upmu$m}}Diamond X-ray beam profiles in x and y measured using a gold wire. |
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 | Calibration curve for ABCN-25 device: the threshold corresponding to the expected input charge is {\unit[109/145]{mV}} before/after trimming.Caption not extracted |
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 | Silicon strip sensor with a strip pitch of {\unit[74.5]{$\upmu$m}}. Aluminium bond pads (red area) are added to the strips (dark grey area) to allow for electrical connections between sensor strips and readout channels by wire bonds. With the width of the bond pads being close to the strip pitch, the p-stops (dashed white line) need to be guided around the bond pads, leading to a larger distance to the strip implant beneath the bond pad and a smaller distance to the adjacent strip implant without a bond pad. The dashed black line indicates the approximate beam positions during the scan. |
 | Hits obtained from one channel of an ABCN-25 module while scanning across the connected silicon sensor strip in steps of {\unit[10]{$\upmu$m}}.Fine strip scans across three strips of a sensor for only the central strip, measured repeatedly at each beam position by using the same number of triggers for different readout thresholds. Due to time constraints, the scanning time for the ABCN-25 module (left) had to be reduced by increasing the position step size and decreasing the numbers of thresholds and triggers in the scan, leading to an overall lower number of hits per bin. |
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 | ABCN-25 module sensor scan: individual and combined hits from three adjacent strips for a fine strip scan across three strips (cyan, red and blue), showing the individual hits at a threshold of {\unit[105.6]{mV}}. The collected hits for the three channels fit both the positions of the strips and the sensor strip pitch well. This sensor does not have p-stop implants.Caption not extracted |
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