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Upper figure: one of the COB ASUs in a table, before ASIC wire bonding. This board is the result of a collaboration between the LAL and Omega institutes from France (CNRS-IN2P3) with the Sungkyunkwan University from South Korea and the EOS Corporation also from South Korea. Lower figure: detail of one Skiroc 2a wirebonded in one of the COBs. To protect the ASIC but keeping visual access to the wires, a watch glass has been added in top of it. For future productions it is foreseen that the ASICs will be protected with a synthetic resin.
Upper figure: one of the COB ASUs in a table, before ASIC wire bonding. This board is the result of a collaboration between the LAL and Omega institutes from France (CNRS-IN2P3) with the Sungkyunkwan University from South Korea and the EOS Corporation also from South Korea. Lower figure: detail of one Skiroc 2a wirebonded in one of the COBs. To protect the ASIC but keeping visual access to the wires, a watch glass has been added in top of it. For future productions it is foreseen that the ASICs will be protected with a synthetic resin.
Left: drawing of the spatial constraints for the control and readout electronics of the SiW-ECAL detector layers. Right: drawing of the full front-end system for one of the barrel modules of the SiW-ECAL for the ILD.
First figure: the first version of SL-Board tested in beam test. Second figure: an SL-BOARD connected to an ASU (backside) in the left and an SL-Board with copper and Kapton foil used for the high voltage supply of the sensors. Third figure: one SL-Board connected to the CORE Mother/Daughter system through the CORE Kapton.
First figure: the first version of SL-Board tested in beam test. Second figure: an SL-BOARD connected to an ASU (backside) in the left and an SL-Board with copper and Kapton foil used for the high voltage supply of the sensors. Third figure: one SL-Board connected to the CORE Mother/Daughter system through the CORE Kapton.
First figure: the first version of SL-Board tested in beam test. Second figure: an SL-BOARD connected to an ASU (backside) in the left and an SL-Board with copper and Kapton foil used for the high voltage supply of the sensors. Third figure: one SL-Board connected to the CORE Mother/Daughter system through the CORE Kapton.
Upper figure: the CORE Mother. Lower figure: the CORE Daughter.
Upper figure: the CORE Mother. Lower figure: the CORE Daughter.
Screenshot of the main window of the software interface to control and readout the modules.
Top photograph: frontal view of and FEV12 and a COB ASU inside the mechanical structure. Each ASU is connected to SL-Board. Middle photograph: view of the mechanical structure from the point of view of the patch panel of the SL-Board slabs (the patch panel is removed). From right to left (beam upstream to downstream) we see 9 layers made of a plastic plate in which the ASUs plus the front end are mounted. The 5 beam upstreamer layers correspond to 5 FEV13s and the the other 4 to COB, FEV12, FEV12 and COB. Bottom photograph: frontal view of the mechanical structure. In the left we see the single CORE Kapton connector to the outside world while in the right we see the high population of cables for power and readout using the previous generation of the front end electronics.
Top photograph: frontal view of and FEV12 and a COB ASU inside the mechanical structure. Each ASU is connected to SL-Board. Middle photograph: view of the mechanical structure from the point of view of the patch panel of the SL-Board slabs (the patch panel is removed). From right to left (beam upstream to downstream) we see 9 layers made of a plastic plate in which the ASUs plus the front end are mounted. The 5 beam upstreamer layers correspond to 5 FEV13s and the the other 4 to COB, FEV12, FEV12 and COB. Bottom photograph: frontal view of the mechanical structure. In the left we see the single CORE Kapton connector to the outside world while in the right we see the high population of cables for power and readout using the previous generation of the front end electronics.
Top photograph: frontal view of and FEV12 and a COB ASU inside the mechanical structure. Each ASU is connected to SL-Board. Middle photograph: view of the mechanical structure from the point of view of the patch panel of the SL-Board slabs (the patch panel is removed). From right to left (beam upstream to downstream) we see 9 layers made of a plastic plate in which the ASUs plus the front end are mounted. The 5 beam upstreamer layers correspond to 5 FEV13s and the the other 4 to COB, FEV12, FEV12 and COB. Bottom photograph: frontal view of the mechanical structure. In the left we see the single CORE Kapton connector to the outside world while in the right we see the high population of cables for power and readout using the previous generation of the front end electronics.
First plot: MIP distribution for all channels readout by one ASIC of the COB boards. Second plot: equivalent distributions obtained during the same run for all the FEV13s modules. Last plot: event display, again for the same run, showing the signal of all modules for the same event. We see that two electrons separated by $\sim$50 mm interacted with the detector at the same time. One of them even started to shower in the middle of the detector. This event display was obtained before performing any offline module alignment.
First plot: MIP distribution for all channels readout by one ASIC of the COB boards. Second plot: equivalent distributions obtained during the same run for all the FEV13s modules. Last plot: event display, again for the same run, showing the signal of all modules for the same event. We see that two electrons separated by $\sim$50 mm interacted with the detector at the same time. One of them even started to shower in the middle of the detector. This event display was obtained before performing any offline module alignment.
First plot: MIP distribution for all channels readout by one ASIC of the COB boards. Second plot: equivalent distributions obtained during the same run for all the FEV13s modules. Last plot: event display, again for the same run, showing the signal of all modules for the same event. We see that two electrons separated by $\sim$50 mm interacted with the detector at the same time. One of them even started to shower in the middle of the detector. This event display was obtained before performing any offline module alignment.