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Article
Report number	arXiv:2502.04071
Title	The vertexing challenge at FCC-ee
Author(s)	Ilg, Armin (U. Zurich (main)) ; Macchiolo, Anna (U. Zurich (main)) ; Palla, Fabrizio (INFN, Pisa)
Collaboration	FCC Collaboration
Publication	2025
Imprint	2025-02-06
Number of pages	7
In:	JINST 20, 06 (2025) pp.C06069
In:	11th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging (PIXEL 2024), Strasbourg, France, 18 - 22 Nov 2024, pp.C06069
DOI	10.1088/1748-0221/20/06/C06069
Subject category	hep-ex ; physics.ins-det ; Particle Physics - Experiment ; Detectors and Experimental Techniques
Abstract	Following in the footsteps of the LHC, the Future Circular Collider (FCC) plans to be the next multi-generational collider project. In the first stage, FCC-ee will collide intense beams of electrons and positrons at centre of mass energies between 88 and 365 GeV, making it an electroweak, flavour, Higgs and top factory. The unprecedented statistical precision requires FCC-ee experiments to limit their systematic uncertainties to the very minimum. The precise reconstruction of the interaction vertices is central to most measurements at FCC-ee, such as rare flavour physics processes and the measurement of Higgs and Z decays to bottom and charm quarks and taus. This contribution will discuss the requirements of FCC-ee vertex detectors, from the necessary impact parameter resolution via the challenging collision environment at the Z pole to the tight requirement on the material budget, which should be kept below 0.3% of a radiation length per detection layer. Next, the proposed vertex detector designs for FCC-ee are shortly presented, and an outlook is given on novel detector designs and features. The requirements for the vertexing performance translate into requirements for the sensors used for the vertex detector. As discussed in this contribution, they need to feature a spatial resolution of about 3 $μ$m and provide timing information of O(ns-$μ$s) while keeping power consumption minimal to allow for air-cooling of the detector - minimising the detector material budget. The only type of sensor capable of aiming to fulfil such requirements are CMOS Monolithic Active Pixel Sensors (MAPS), which combine signal generation, amplification and readout into a single silicon die. Therefore, the rest of this contribution will present an overview of existing and planned MAPS technologies and prototypes aiming to fulfil the stringent FCC-ee vertex detector requirements.
Copyright/License	publication: © 2025-2026 The Author(s) (License: CC-BY-4.0) preprint: (License: CC BY-SA 4.0)

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