| OPEN Photos / Open / Accelerators | OPEN-PHO-ACCEL-2025-035 |
|
Gold and copper coating by electroplating of BPMs for the HL-LHC
|
|
|---|---|
|
During the in-house production of beam position monitors (BPMs) for the High-Luminosity LHC (HL-LHC), each BPM is coated with gold and copper by a multi-step electroplating process: the BPM is bathed in different solutions and current is applied between an anode and a cathode, causing the desired metal to be reduced on the BPM (cathode). It was first electroplated with gold then with copper. The copper coating (100 microns), is electroplated on the beam-facing inner aperture of the BPM for impedance measures. The gold deposit is an undercoat that allows the copper to adhere to the stainless steel. The gold surface is slightly larger than the overcoat of copper to ensure that all needed surfaces will have the adhesion to the copper. Barriers are fixed on the BPM for the copper electroplating stage to ensure only the required surfaces are electroplated with copper.
|
|
|
Total images: 38
|
|
Record created 2025-11-26, last modified 2025-11-26
JPG
JPG
JPG
