Van Hunen, J J Anelli, G Antinori, Federico Burns, M Banicz, K Campbell, M Caselle, M Caliandro, R Chochula, P Dinapoli, R Easo, S Elia, D Formenti, F Girone, M Gys, Thierry Jusko, A Kluge, A Krivda, M Lenti, V Lupták, M Manzari, V Meddi, F Morel, M Riedler, P Riggi, F Snoeys, W Stefanini, G Wyllie, Ken H 10.5170/CERN-2001-005.85 2001 2001 The Alice1LHCb front-end chip has been designed for the ALICE pixel and the LHCb RICH detectors. It is fabricated in a commercial 0.25 µm CMOS technology, with special design techniques to obtain radiation tolerance. The chip has been irradiated with low energy protons and heavy ions, to determine the cross-section for Single Event Upsets (SEU), and with X-rays to evaluate the sensitivity to total ionising dose. We report the results of those measurements. We also report preliminary results of measurements done with 150 GeV pions at the CERN SPS. Barbosa-Marinho, P R Bediaga, I Barbosa-Ademarlaudo, F Magnin, J Marques de Miranda, J Massafferri, A Reis, A Silva, R Amato, S Colrain, P Da Silva, T De Mello-Neto, J R T De Paula, L S Gandelman, M Lopes, J H Maréchal, B Moraes, D Polycarpo, E Vinci do Santos, S Ajaltouni, Ziad J Böhner, G Breton, V Cornat, R Deschamps, O Falvard, A Henrard, P Lecoq, J Perret, P Rimbault, C Trouilleau, C Ziad, A Aslanides, E Cachemiche, J P Le Gac, R Leroy, O Liotard, P L Menouni, M Potheau, R Tsaregorodtsev, A Yu Tsaregorodtsev, A Yu Barrand, G Beigbeder-Beau, C Breton, D Cacéres, T Callot, O Cros, P D'Almagne, B Delcourt, B Fulda-Quenzer, F Jacholkowska, A Jean-Marie, B Lefrançois, J Machefert, F P Tocut, V Truong, K D Videau, I Schwierz, R Spaan, B Bauer, C Baumeister, D Bulian, N Fuchs, H Glebe, T Hofmann, W Knöpfle, K T Löchner, S Schmelling, M Schwingenheuer, B Sciacca, F Sexauer, E Trunk, U Bachmann, S Bock, P Deppe, H Eisele, Franz Feuerstack-Raible, M Henneberger, S Igo-Kemenes, P Rusnyak, R Stange, U Walter, M Wiedner, D Uwer, U Lindenstruth, V Richter, R Schulz, M W Walsch, A Bencivenni, G Bloise, C Bossi, F Campana, P Capon, G De Simone, P Forti, C Franceschi, M A Murtas, F Passalacqua, L Patera, V Sciubba, A Bargiotti, M Bertin, A Bruschi, M Capponi, M D'Antone, I De Castro, S Faccioli, P Fabbri, Franco Luigi Galli, D Giacobbe, B Marconi, U Massa, I Piccinini, M Poli, M Semprini-Cesari, N Spighi, R Vagnoni, V M Vecchi, S Villa, M Vitale, A Zoccoli, A Cardini, A Caria, M Lai, A Pinci, D Saitta, B Baldini, W Carassiti, V Cotta-Ramusino, A Dalpiaz, P Gianoli, A MArtini, M Petrucci, F Savrié, M Bizzeti, A Calvetti, M Collazuol, G Iacopini, E Lenti, M Martelli, F Passaleva, G Veltri, M Cueno, S Fontanelli, F Gracco, V Musico, P Petrolini, A Sannino, M Alemi, M Bellunato, T F Calvi, M Metteuzzi, C Musy, M Negri, P Paganoni, M Piazzoni, C Auriemma, G Bocci, V Bosio, V Fidanza, D Frenkel, A Harrison, K Martellotti, G Martínez, S Penso, G Santacesaria, R Satriano, C Satta, A Carboni, G Dominici, Daniele Ganis, G Messi, R Pacciani, L Paoluzi, L Santovetti, E van Apeldoorn, G Arink, R Van Bakel, N Bauer, T S Berkien, A Van Beuzekom, M G Van den Born, E A Van den Brand, J F J Bulten, H J Cârloganu, C Ceelie, L Doets, M Van der Eijk, R Gouz, I Gromov, V Hierck, R Hommels, l Jans, E Ketel, T Klous, S Köne, B Kruiper, H Merk, M Mul, F Needham, M Van Petten, O Schuijlenburg, H Sluijk, T Stolte, J Van Tilburg, J De Vries, H Wiggers, L Van Wijk, R F Zupan, M Zwart, A Gao, C S Jiang, C Sun, H Zhu, Z Bisset, M Cheng, J P Cui, Y G Gao, Y He, H J Kuang Yu Ping Li, Y J Li, Q Liao, Y Ni, J P Shao Bei Bei Su, J J Tian, Y R Wang, Q Yan, Q S Banas, E Blocki, J Galuszka, K Hajduk, L Jalocha, P Kapusta, P Kisielewski, B Kucewicz, W Lesiak, T Michalowski, J Muryn, B Natkaniec, Z Ostrowicz, W Polok, G Rulikowska-Zarebska, E Stodulski, M Witek, M Zychowski, P Adamus, M Chlopik, A Guzik, Z Nawrot, A Szekowski, M Anghel, D V Coca, C Cimpean, A Giolu, G Magureanu, C Popescu, S Preda, T Rosca, A M Rusu, V L Bolotov, V N Filippov, S N Gavrilov, J Guschin, E Kloubov, V Kravchuk, L V Laptek, S Laptev, V D Postoev, V E Sadovskii, A Semeniouk, I N Barsuk, S Belyaev, I Golutvin, A Gouchtchine, O Kiritchenko, V Kostina, G Soldatov, A Tarkovski, E Beloborodov, K I Bondar, A E Bozhenok, A Buzulutskov, A F Eidelman, S Golubev, V B Oreshkin, S B Poluektov, A Serednyakov, S I Shekhtman, L I Shwartz, B A Silagadze, Z K Sokolov, A Vasilev, A Afanasieva, L A Ajinenko, I Belous, K S Brekhovskikh, V Denissov, S Dorokhov, A V Dzhelyadin, R I Kobelev, A Konoplyannikov, A K Likhoded, A K Matveev, V D Novikov, V Obraztsov, V F Ostankov, A P Rykalin, V I Semenov, V K Shapkin, M M Smirnov, N Soldatov, M M Talanov, V V Yushchenko, O P Botchine, B Guetz, S Lazarev, V A Saguidova, N Spiridenkov, E M Vorobyov, A Vorobyov, A A Aguiló, E Ballabriga-Sune, Rafael Ferragut, S Garrido, L Gascón, D Graciani-Díaz, R Luengo, S Miquel, R Peralta, D Roselló, M Vilasís, X Adeva, B Conde, P Gómez, F Hernando, J A Iglesias, A López-Aguera, A Pazos, A Pló, M Rodríguez, J M Saborido, J J Tobar, M J Bartalini, P Bay, A Carron, B Currat, C Dormond, O Dürrenmatt, F Ermoline, Y Frei, R Gagliardi, G Haefeli, G Hertig, J P Koppenburg, P Nakada, Tatsuya Perroud, Jean-Pierre Ronga, F Schneider, O Studer, L Tareb, M Tran, M T Bernet, R Holzschuh, E Sievers, P Steinkamp, O Straumann, U Wyler, D Ziegler, M Dovbnya, A Maznichenko, S Omelaenko, O Ranyuk, Yu Shulayev, V Aushev, V M Kiva, V Kolomiets, I Pavlenko, Ya V Pugatch, V Vasilev, Yu Zerkin, V A Brook, N H Cole, J E Head, R D Phillips, A Wilson, F F George, K Gibson, V Jones, C R Katvars, S G Shepherd-Themistocleous, C H Ward, C P Wotton, S A Brew, C A J Densham, C J Easo, S Franek, B J Guy, J G V Halsall, R Lidbury, J A Morris, J V Papanestis, A Patrick, G N Soler, F J P Temple, S A Woodward, M L Eisenhardt, S Khan, A Muheim, F Playfer, S Walker, A Flavell, A J Halley, A O'Shea, V Soler, F J P Biagi, S F Bowcock, T J V Gamet, R McCubbin, M L Parkes, C Patel, G Wright, V Barber, G J Clark, D Dauncey, P Duane, A Girone, M Hassard, J Hill, R John, M J J Jolly, S Price, D R Savage, P Simmons, B Toudup, L W Websdale, David M Adinolfi, M Damerell, G Bibby, J Charles, M J Harnew, N Harris, F McArthur, I C Rademacker, J Smale, N J Topp-Jørgensen, S Wilkinson, G Anelli, G Anghinolfi, Francis Bal, F Benayoun, M Beneyton, R Bonivento, W Braem, André Buytaert, J Campbell, M Cass, A J Cattaneo, M Charpentier, P Chesi, Enrico Guido Christiansen, J Chytracek, R Closier, J Collins, P Corti, G D'Ambrosio, C Dijkstra, H Dufey, J P Ferro-Luzzi, M Fiedler, F Flegel, Wilfried Formenti, F Forty, Roger W Frank, M Frei, C García-Alfonso, I Gaspar, C Gavillet, P Gracía-Abríl, G Guirao-Elias, A Gys, Thierry Hahn, F Haider, S Harvey, J Hay, B Van Herwijnen, Eric Hilke, Hans Jürgen Von Holtey, G Hutchroft, D Jacobsson, R Jarron, Pierre Joram, Christian Jost, B Lacarrère, D Laub, M Letheren, M F Lippmann, C Lindner, R Losasso, M Mato-Vila, P Müller, H Neufeld, N Ocariz, J Osterbeg, K Padilla, C Parzefall, U Ponce, S Ranjard, F Riegler, W Röhner, F Roiser, S Ruf, T Schmeling, S Schmidt, B Schneider, T Schopper, A Snoeys, W Souvorov, V Tejessy, W Teubert, F Toledo-Alarcón, J Ullaland, O Valassi, Andrea Vázquez-Regueiro, P Wertelaers, Piet Wright, A Wyllie, K 2001 2001 Snoeys, W Campbell, M Cantatore, E Cencelli, V Dinapoli, R Heijne, Erik H M Jarron, Pierre Lamanna, P Minervini, D O'Shea, V Quiquempoix, V San Segundo-Bello, D Van Koningsveld, B Wyllie, Ken H Nucl. Instrum. Methods Phys. Res., A 10.1016/S0168-9002(01)00388-6 176-189 465 1 2001 2001 The ALICE1LHCB pixel readout chip emerged from previous experience at CERN. The RD-19 collaboration provided the basis for the installation of a pixel system in the WA97 and NA57 experiments. Operation in these experiments was key in the understanding of the system issues. In parallel the RD-49 collaboration provided the basis to obtain radiation tolerance in commercial submicron CMOS through special circuit layout. The new ALICE1LMB chip was developed to serve two different applications: particle tracking in the ALICE Silicon Pixel Detector and particle identification in the LHCb Ring Imaging Cherenkov detector. To satisfy the different needs for these two experiments, the chip can be operated in two different modes. In tracking mode all the 50 mu m*435 mu m pixel cells in the 256*32 array are read out individually, whilst in particle identification mode they are combined in groups of 8 to form a 32*32 array of 400 mu m*425 mu m cells. The circuit is currently being manufactured in a commercial 0.25 mu m CMOS technology. (43 refs). Campbell, M Heijne, Erik H M Kubasta, J Middelkamp, P Pospísil, S Sícho, P Snoeys, W Vrba, V 1997 1997 Di Bari, D Antinori, Federico Barberis, D Becks, K H Beker, H Beusch, Werner Burger, P Campbell, M Cantatore, E Catanesi, M G Chesi, Enrico Guido Darbo, G D'Auria, S D Da Vià, C Di Liberto, S Elia, D Gys, Thierry Heijne, Erik H M Helstrup, H Jacholkowski, A Jaeger, J J Jakubek, J Jarron, Pierre Klempt, W Krummenacher, F Knudson, K P Králik, I Kubasta, J Lassalle, J C Leitner, R Lemeilleur, F Lenti, V Letheren, M F López, L Loukas, D Lupták, M Manzari, V Martinengo, P Meddeler, G Meddi, F Morando, M Munns, A Pellegrini, F Pengg, F X Pospísil, S Quercigh, Emanuele Rídky, J Rossi, L Safarík, K Saladino, S Scharfetter, L H H Segato, G F Simone, S Smith, K Snoeys, W Tomasicchio, G Vrba, V 1997 1997 Scharfetter, L H H Campbell, M Cantatore, E Heijne, Erik H M Howard, A Middelkamp, P Snoeys, W 1997 1997 Amendolia, S R Beccherle, R Bertolucci, Ennio Bisogni, M G Bottigli, U Campbell, M Chesi, Enrico Guido Ciocci, M A Conti, M Da Vià, C Del Guerra, A D'Auria, S D Fantacci, M E Gambaccini, M Grossi, G Heijne, Erik H M Mancini, E Marchesini, R Middelkamp, P O'Shea, V Randaccio, P Romeo, N Rosso, V Russo, P Scharfetter, L H H Smith, K Snoeys, W Stefanini, A 1996 1996 Snoeys, W Antinori, Federico Barberis, D Becks, K H Beker, H Beusch, Werner Burger, P Campbell, M Cantatore, E Catanesi, M G Chesi, Enrico Guido Darbo, G D'Auria, S D Da Vià, C Di Bari, D Di Liberto, S Elia, D Gys, Thierry Heijne, Erik H M Helstrup, H Jacholkowski, A Jaeger, J J Jakubek, J Jarron, Pierre Klempt, W Krummenacher, F Knudson, K P Králik, I Kubasta, J Lasalle, J C Leitner, R Lemeilleur, F Lenti, V Letheren, M F López, L Loukas, D Lupták, M Martinengo, P Meddeler, G Meddi, F Menetrey, A Middelkamp, P Morando, M Munns, A Musico, P Pellegrini, F Pengg, F X Pospísil, S Quercigh, Emanuele Rídky, J Rossi, L Safarík, K Scharfetter, L H H Segato, G F Simone, S Smith, K Sobczynski, C W Stastny, J Vrba, V 1995 1995 Heijne, Erik H M Antinori, Federico Barberis, D Becks, K H Beker, H Beusch, Werner Burger, P Campbell, M Cantatore, E Catanesi, M G Chesi, Enrico Guido Darbo, G D'Auria, S D Da Vià, C Di Bari, D Di Liberto, S Gys, Thierry Humpston, G Jacholkowski, A Jaeger, J J Jakubek, J Jarron, Pierre Klempt, W Krummenacher, F Knudson, K P Kubasta, J Lassalle, J C Leitner, R Lemeilleur, F Lenti, V Letheren, M F Lisowski, B López, L Loukas, D Lupták, M Martinengo, P Meddeler, G Meddi, F Middelkamp, P Morando, M Morettini, P Munns, A Musico, P Pellegrini, F Pengg, F X Pospísil, S Quercigh, Emanuele Rídky, J Rossi, L Safarík, K Scharfetter, L H H Segato, G F Simone, S Smith, K Snoeys, W Sobczynski, C W Stastny, J Vrba, V 10.1016/S0168-9002(96)00658-4 1996 1996 Heijne, Erik H M Antinori, Federico Barberis, D Beker, H Beusch, Werner Burger, P Campbell, M Cantatore, E Catanesi, M G Chesi, Enrico Guido Darbo, G D'Auria, S D Da Vià, C Di Bari, D Di Liberto, S Elia, D Gys, Thierry Helstrup, H Heuser, J M Jacholkowski, A Jarron, Pierre Klempt, W Králik, I Krummenacher, F Lasalle, J C Leitner, R Lemeilleur, F Lenti, V Lokajícek, M López, L Lupták, M Maggi, G Martinengo, P Meddi, F Menetrey, A Middelkamp, P Morando, M Munns, A Musico, P Pellegrini, F Pospísil, S Quercigh, Emanuele Rídky, J Rossi, L Safarík, K Saladino, S Segato, G F Simone, S Snoeys, W Stefanini, G Vrba, V 1995 1995 Snoeys, W Burns, M Campbell, M Cantatore, E Cencelli, V Dinapoli, R Heijne, Erik H M Jarron, Pierre Lamanna, P Minervini, D Morel, M O'Shea, V Quiquempoix, V San Segundo-Bello, D Van Koningsveld, B Wyllie, Ken H Nucl. Instrum. Methods Phys. Res., A 10.1016/S0168-9002(01)00590-3 366-75 466 2 2001 2001 The ALICE1LHCB chip is a mixed-mode integrated circuit designed to read out silicon pixel detectors for two different applications: particle tracking in the ALICE Silicon Pixel Detector and particle identification in the LHCb Ring Imaging Cherenkov detector. To satisfy the different needs for these two experiments, the chip can be operated in two different modes. In tracking mode all the 50 mu m *425 mu m pixel cells in the 256*32 array are read out individually, whilst in particle identification mode they are combined in groups of 8 to form a 32*32 array of 300 mu m x 425 mu m cells. Radiation tolerance was enhanced through special circuit layout. Sensitivity to coupling of digital signals into the analog front end was minimized. System issues such as testability and uniformity further constrained the design. The circuit is currently being manufactured in a commercial 0.25 mu m CMOS technology. (28 refs). Dinapoli, R Campbell, M Cantatore, E Cencelli, V Heijne, Erik H M Jarron, Pierre Lamanna, P Shea, V O Quiquempoix, V San Segundo-Bello, D Snoeys, W Van Koningsveld, B Wyllie, Ken H 10.5170/CERN-2000-010.110 2000 2000 Burns, M Antinori, Federico Bán, J Campbell, M Chochula, P Formenti, F Grassi, T Kluge, A Lisco, P Meddi, F Morel, M Snoeys, W Stefanini, G Wyllie, Ken H 10.5170/CERN-2000-010.105 2000 2000 Ropotar, I Cantatore, E Antinori, Federico Becks, K H Beker, H Buis, E J Burger, P Campbell, M Casagrande, L Catanesi, M G Chesi, Enrico Guido D'Auria, S D Da Vià, C Di Bari, D Di Liberto, S Gys, Thierry Heijne, Erik H M Humpston, G Jacholkowski, A Jaeger, J J Klempt, W Kubasta, J Leitner, R Lenti, V Lupták, M Martinengo, P Mazzoni, M A Meddeler, G Meddi, F Middelkamp, P Mikulec, B Morando, M Pellegrini, F Pospísil, S Quercigh, Emanuele Rídky, J Safarík, K Saladino, S Scharfetter, L H H Segato, G F Simone, S Smith, K Snoeys, W Sobczynski, C W Tomasicchio, G Vrba, V Nucl. Instrum. Methods Phys. Res., A 10.1016/S0168-9002(99)00898-0 536-46 439 2-3 2000 2000 Snoeys, W Anelli, G Campbell, M Cantatore, E Faccio, F Heijne, Erik H M Jarron, Pierre Kloukinas, Kostas C Marchioro, A Moreira, P Toifl, Thomas H Wyllie, Ken H IEEE J. Solid State Circuits 10.1109/4.890318 2018-30 (digest) 35 12 2000 2000 High energy particle physics experiments investigate the nature of matter through the identification of subatomic particles produced in collisions of protons, electrons, or heavy ions which have been accelerated to very high energies. Future experiments will have hundreds of millions of detector channels to observe the interaction region where collisions take place at a 40 MHz rate. This paper gives an overview of the electronics requirements for such experiments and explains how data reduction, timing distribution, and radiation tolerance in commercial CMOS circuits are achieved for these big systems. As a detailed example, the electronics for the innermost layers of the future tracking detector, the pixel vertex detector, is discussed with special attention to system aspects. A small-scale prototype (130 channels) implemented in standard 0.25 mu m CMOS remains fully functional after a 30 Mrad(SiO/sub 2/) irradiation. A full-scale pixel readout chip containing 8000 readout channels in a 14 by 16 mm/sup 2/ area has been designed. (24 refs). The Large Hadron Collider (LHC) under construction at CERN (Geneva, Switzerland) will be operational in the year 2005. The LHC will host four detectors, ATLAS, ALICE, CMS and LHCb. They each will have tens of millions of sensor channels and will be the "electronic eyes" looking at the intersection regions where collisions of protons of 7 TeV energy will take place at a frequency of 40 MHz, each producing a spray of several thousand particles. As the newly created particles fly away from the collision point, they traverse several detector layers: the tracker, the calorimeter and finally the muon detector. The authors discuss the electronics required for such detectors in high-energy physics experiments. They conclude that modern commercial deep submicron CMOS technology offers the required density and performance for the electronics, and provides through special layout techniques the radiation tolerance essential for the experiments at LHC. (5 refs). Antinori, Federico Badalà, A Barbera, R Beker, H Bloodworth, Ian J Botje, M Caliandro, R Campbell, M Cantatore, E Carena, W Carrer, N De Haas, A P Di Bari, D Di Liberto, S Divià, R Elia, D Evans, D Fanebust, K Fedorisin, J Feofilov, G A Fini, R A Ftácnik, J Ghidini, B Grella, G Gulino, M Helstrup, H Holme, A K Jacholkowski, A Jones, G T Jovanovic, P Jusko, A Kamermans, R Kinson, J B Klempt, W Knudson, K P Koeper, B Kolojvari, A A Králik, I Kuijer, P G Lenti, V Lietava, R Løvhøiden, G Lupták, M Manzari, V Mazzoni, M A Martinská, G Meddi, F Michalon, A Michalon-Mentzer, M E Morando, M Nappi, E Navach, F Norman, P I Palmeri, A Pappalardo, G S Pastircák, B Pellegrini, F Píska, K Pisút, J Pisútová, N Posa, F Quercigh, Emanuele Riggi, F Romano, G Safarík, K Sándor, L Schillings, E Segato, G F Sené, M Sené, R Snoeys, W Staroba, P Stolyarov, O I Thompson, M Thorsteinsen, T F Tomasicchio, G Torrieri, G D Tsimbal, F A Tulina, T A Tveter, T S Urbán, J Valiev, F F Van den Brink, A Van de Ven, P Van de Vyvre, P van Eijndhoven, N Vannucci, Luigi Vascotto, Alessandro Villalobos Baillie, O Vinogradov, I Virgili, T Votruba, M F Vrláková, J Závada, P Nucl. Phys. A 10.1016/S0375-9474(99)85125-2 716-20 661 1999 1999 In this paper, after recalling the main features of the NA57 experiment, we describe its silicon pixel tracker. (9 refs). Albrecht, E Alemi, M Barber, G J Bibby, J H Campbell, M Duane, A Gys, Thierry Montenegro, J Piedigrossi, D Schomaker, R Snoeys, W Wotton, S A Wyllie, Ken H Nucl. Instrum. Methods Phys. Res., A 10.1016/S0168-9002(99)01216-4 164-70 442 1-3 2000 2000 We report on the ongoing work towards a hybrid photon detector with integrated Si pixel readout for the ring imaging Cherenkov detectors of the LHCb experiment at the Large Hadron Collider at CERN. The photon detector is based on an electrostatically focussed image intensifier tube geometry where the image is de-magnified by a factor of ~5. The anode consists of a silicon pixel array, bump-bonded to a binary readout chip with matching pixel electronics. The performance of full-scale prototypes equipped with 61-pixel anodes and external analogue readout is presented. The average signal-to-noise ratio is ~11 with a peaking time of 1.2 mu s. The tube active-to-total surface ratio is 81.7%, which meets the LHCb requirements. The spatial precision is measured to be better than 90 mu m. A cluster of three such tubes has been installed in the LHCb RICH 1 prototype where Cherenkov gas rings have been successfully detected. Progress towards the encapsulation of new pixel electronics into a tube is also reported. In particular, the status of the development of a binary readout chip with a peaking time of 25 ns and a low and uniform detection threshold is summarized. (11 refs). Wyllie, Ken H Burns, M Campbell, M Cantatore, E Cencelli, V Dinapoli, R Formenti, F Grassi, T Heijne, Erik H M Jarron, Pierre Kloukinas, Kostas C Lamanna, P Morel, M O'Shea, V Quiquempoix, V San Segundo-Bello, D Snoeys, W 10.5170/CERN-1999-009.93 1999 1999 Snoeys, W Faccio, F Burns, M Campbell, M Cantatore, E Carrer, N Casagrande, L Cavagnoli, A Dachs, C Di Liberto, S Formenti, F Giraldo, A Heijne, Erik H M Jarron, Pierre Letheren, M F Marchioro, A Martinengo, P Meddi, F Mikulec, B Morando, M Morel, M Noah, E Paccagnella, A Ropotar, I Saladino, S Sansen, Willy Santopietro, F Scarlassara, F Segato, G F Signe, P M Soramel, F Vannucci, Luigi Vleugels, K Nucl. Instrum. Methods Phys. Res., A 10.1016/S0168-9002(99)00899-2 349-60 439 2-3 2000 2000 A new pixel readout prototype has been developed at CERN for high- energy physics applications. This full mixed mode circuit has been implemented in a commercial 0.5 mu m CMOS technology. Its radiation tolerance has been enhanced by designing all NMOS transistors in enclosed geometry and introducing guardrings wherever necessary. The technique is explained and its effectiveness demonstrated on various irradiation measurements on individual transistors and on the prototype. Circuit performance started to degrade only after a total dose of 600 krad-1.7 Mrad depending on the type of radiation. 10 keV X-rays, /sup 60/Co gamma-rays, 6.5 MeV protons, and minimum ionizing particles were used. Implications of this layout approach on the circuit design and perspectives for even deeper submicron technologies are discussed. (20 refs). IEEE Trans. Nucl. Sci. 10.1109/23.819250 1901-1906 46 1999 1999 We report on the ongoing work towards a hybrid photon detector with integrated silicon pixel readout for the ring imaging Cherenkov detectors of the LHCb experiment at the Large Hadron Collider at CERN. The photon detector is based on a cross-focussed image intensifier tube geometry where the image is de-magnified by a factor of 4. The anode consists of a silicon pixel array, bump-bonded to a fast, binary readout chip with matching pixel electronics. The performance of a half-scale prototype is presented, together with the developments and tests of a full-scale tube with large active area. Specific requirements for pixel front-end and readout electronics in LHCb are outlined, and recent results obtained from pixel chips applicable to hybrid photon detector design are summarized. Campbell, M Anelli, G Burns, M Cantatore, E Casagrande, L Delmastro, M Dinapoli, R Faccio, F Heijne, Erik H M Jarron, Pierre Lupták, M Marchioro, A Martinengo, P Minervini, D Morel, M Pernigotti, E Ropotar, I Snoeys, W Wyllie, Ken H IEEE Trans. Nucl. Sci. 10.1109/23.775506 156-160 46 1999 1999 A radiation tolerant pixel detector readout chip has been developed in a commercial 0.25 mu m CMOS process. The chip is a matrix of two columns of 65 identical cells. Each readout cell comprises a preamplifier, a shaper filter, a discriminator, a delay line and readout logic. The chip occupies 10 mm/sup 2/, and contains about 50000 transistors. Electronic noise (~220 e rms) and threshold dispersion (~160 e rms) allow operation at 1500 e average threshold. The radiation tolerance of this mixed mode analog-digital circuit has been enhanced by designing NMOS transistors in enclosed geometry and introducing guardrings wherever necessary. The chip, which was developed at CERN for the ALICE and LHCb experiments, was still operational after receiving 3.6*10/sup 13/ protons over an area of 2 mm *2 mm. Other chips were irradiated with X-rays and remained fully functional up to 30 Mrad(SiO2) with only minor changes in analog parameters. These results indicate that careful use of deep submicron CMOS technologies can lead to circuits with high radiation tolerance. Snoeys, W Burns, M Campbell, M Cantatore, E Dinapoli, R Faccio, F Heijne, Erik H M Jarron, Pierre Marchioro, A Martinengo, P Minervini, D Morel, M Pernigotti, E Ropotar, I Wyllie, Ken H Lupták, M 1998 1998 Alemi, M Campbell, M Gys, Thierry Mikulec, B Piedigrossi, D Puertolas, D Rosso, E Schomaker, R Snoeys, W Wyllie, Ken H Nucl. Instrum. Methods Phys. Res., A 10.1016/S0168-9002(99)01448-5 48 449 1-2 2000 2000 We report on the first operation of a hybrid photon detector prototype with integrated silicon pixel readout for the ring imaging Cherenkov detectors of the LHCb experiment. The photon detector is based on a cross-focussed image intensifier tube geometry where the image is de-magnified by a factor of 4. The anode consists of a silicon pixel array, bump-bonded to a binary readout chip with matching pixel electronics. The prototype has been characterized using a low-intensity light-emitting diode operated in pulsed mode. Its performance in terms of single-photoelectron detection efficiency and imaging properties is presented. A model of photoelectron detection is proposed, and is shown to be in good agreement with the experimental data. It includes an estimate of the charge signal generated in the silicon detector, and the combined effects of the comparator threshold spread of the pixel readout chip, charge sharing at the pixel boundaries and back-scattering of the photoelectrons at the silicon detector surface.