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2.
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Manufacturing of pixel detectors at Tesla SEZAM
/ Frys, M ; Kapsia, S ; Spetik, Z ; Sezam, T ; Radhostem, R P ; Jurka, V ; Vrba, V
Tesla SEZAM is one of the producers of pixel detectors for the ATLAS experiment at CERN. In the present paper specific design features of sensors and basic processing steps for the manufacturing of sensor structures are described. [...]
2002
In : The 4th International Conference on Advanced Semiconductor Devices and Microsystems, Smolenice, Slovakia, 4 - 16 Oct 2002, pp.363-367
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6.
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Technical Specifications of the First Prototype Pixel Sensors for ATLAS.
/ Alam, M ; Bonzom, V ; Brandl, A ; D'Auria, S ; Delpierre, P A ; Einsweiler, K F ; Gilchriese, M G D ; Gorfine, G ; Holland, S ; Hügging, F G et al.
ATL-INDET-97-180 ; ATL-I-PN-180.
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1997.
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13.
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Pixel detector back-up Document to support the ATLAS Technical Proposal
/ Fischer, P ; Raith, B ; Wermes, N ; Lankford, A ; Pier, S ; Schmid, B ; Campbell, M ; Jarron, P ; Heijne, Erik H M ; Middelkamp, P et al.
ATL-INDET-94-086 ; ATL-I-PN-86.
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1994.
Full text - Full text - Full text - Full text - Access to fulltext document - Access to fulltext document - Access to fulltext document - Access to fulltext document
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23.
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MCC: the Module Controller Chip for the ATLAS Pixel Detector.
/ Beccherle, R (INFN, Genoa ; Genoa U.) ; Blanquart, L (LBL, Berkeley ; UC, Berkeley) ; Boyd, R (Oklahoma U.) ; Calvet, D (Clermont-Ferrand U.) ; Comes, G (Bonn U.) ; Darbo, G (INFN, Genoa ; Genoa U.) ; Einsweiler, K F (LBL, Berkeley ; UC, Berkeley) ; Fischer, P (Bonn U.) ; Gagliardi, G (INFN, Genoa ; Genoa U.) ; Gemme, C (INFN, Genoa ; Genoa U.) et al.
In this article we describe the architecture of the Module Controller Chip for the ATLAS Pixel Detector. [...]
ATL-INDET-2002-002.
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2002. - 26 p.
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25.
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Electrical Characteristics of Silicon Pixel Sensors
/ Gorelov, I ; Gorfine, G ; Hoeferkamp, M ; Mata-Bruni, V ; Santistevan, G ; Seidel, S C ; Ciocio, A ; Einsweiler, K F ; Emes, J ; Gilchriese, M G D et al.
Prototype sensors for the ATLAS silicon pixel detector have been electrically characterized. [...]
ATL-INDET-2001-011.
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2001. - 24 p.
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34.
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CONCEPTUAL DESIGN OF C3F8 LOCAL CONDENSER SYSTEM FOR ATLAS PIXEL COOLING
/ Olcese, M ; Grohmann, S
The conceptual design of an evaporative cooling system for the ATLAS Pixel detector, using C3F8 as coolant, is described.The main elements and components of the system are discussed and a detailed safety analysis is presented.The proposed local condenser concept shows interesting advantages with respect to the compressor-based systems mainly because it implements standard, simple and reliable technologies..
ATL-INDET-2000-002.
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1999.
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37.
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The ATLAS Silicon Pixel Sensors
/ Alam, M S (SUNY, Albany) ; Ciocio, A ; Einsweiler, K F ; Emes, J ; Gilchriese, M G D ; Joshi, A ; Kleinfelder, S A ; Marchesini, R ; McCormack, F ; Milgrome, O et al.
Prototype sensors for the ATLAS silicon pixel detector have been developed. [...]
ATL-INDET-99-012 ; CERN-EP-99-152.
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2001. - 34 p.
Fulltext - Fulltext - Fulltext - CERN library copies
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45.
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Test Beam Coordination: 2003 ATLAS Combined Test Beam-
The 2003 Test Beam Period The 2003 Test Beam period has been very fruitful for ATLAS. In spite of several days lost because of the accelerator problems, ATLAS has been able to achieve many results: FCAL has completed the calibration program in H6 Tilecal has completed the calibration program in H8 Pixel has performed extensive studies with normal and high intensity beams (up to 1.4*108 hadrons/spill) SCT has completed a variety of studies with quite a high number of modules operated concurrently TRT has performed several studies at high, low and very low energy (first use of the new H8 beam in the range 1 to 9 GeV) Muons (MDT,RPC and TGC) have been operating a large setup for about 5 months [...]
[ATL-ENEWS-2003-021]-
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49.
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New results on diamond pixel sensors using ATLAS frontend electronics
/ Keil, Markus ; Adam, W ; Berdermann, E ; Bergonzo, P ; de Boer, Wim ; Bogani, F ; Borchi, E ; Brambilla, A ; Bruzzi, Mara (INFN and Universita', Firenze, Italy) ; Colledani, C et al.
Diamond is a promising sensor material for future collider experiments due to its radiation hardness. Diamond pixel sensors have been bump bonded to an ATLAS pixel readout chip using PbSn solder bumps. [...]
2003
- Published in : Nucl. Instrum. Methods Phys. Res., A 501 (2003) 153-159
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50.
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Radiation-hard ASICs for optical data transmission in the ATLAS pixel detector
/ Gan, K.K. (Ohio State U.) ; Arms, Kregg E. (Ohio State U.) ; Johnson, M. (Ohio State U.) ; Kagan, H. (Ohio State U.) ; Kass, R. (Ohio State U.) ; Rush, C. (Ohio State U.) ; Smith, S. (Ohio State U.) ; Ter-Antonian, R. (Ohio State U.) ; Zoeller, M.M. (Ohio State U.) ; Ciliox, A. (Siegen U.) et al.
We have developed two radiation-hard ASICs for optical data transmission in the ATLAS pixel detector at the LHC at CERN: a driver chip for a Vertical Cavity Surface Emitting Laser (VCSEL) diode for 80 Mbit/s data transmission from the detector, and a Bi-Phase Mark decoder chip to recover the control data and 40 MHz clock received optically by a PIN diode. We have successfully implemented both ASICs in 0.25 um CMOS technology using enclosed layout transistors and guard rings for increased radiation hardness. [...]
hep-ex/0303019.-
Columbus, OH : CERN, 2003 - 6 p.
- Published in : , pp. 282-287
Fulltext: PDF; Published version from CERN: PDF; External link: hep-ex/0303019 PDF
In : 9th Workshop on Electronics for LHC Experiments, pp.102-106
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51.
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Electrical characteristics of silicon pixel detectors
/ Gorelov, I ; Gorfine, G W ; Hoeferkamp, M ; Mata-Bruni, V ; Santistevan, G ; Seidel, S C ; Ciocio, A ; Einsweiler, Kevin F ; Emes, J ; Gilchriese, M G D et al.
Prototype sensors for the ATLAS silicon pixel detector have been electrically characterized. The current and voltage characteristics, charge-collection efficiencies, and resolutions have been examined. [...]
2002
- Published in : Nucl. Instrum. Methods Phys. Res., A 489 (2002) 202-217
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56.
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Design studies on sensors for the ATLAS Pixel Detector
/ Hügging, F G
For the ATLAS Pixel Detector, prototype sensors have been successfully developed. For the sensors design, attention was given to survivability of the harsh LHC radiation environment leading to the need to operate them at several hundreds of volts, while maintaining a good charge collection efficiency, small cell size and minimal multiple scattering. [...]
2002
- Published in : Nucl. Instrum. Methods Phys. Res., A 477 (2002) 143-9
In : 5th International Conference on Position-sensitive Detectors, London, UK, 13 - 17 Sep 1999, pp.143-9
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62.
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Studies for a Detector Control System for the ATLAS Pixel Detector
/ Kersten, S ; Bayer, C ; Berry, S ; Bonneau, P ; Bosteels, Michel ; Hallewell, G D ; Imhäuser, M ; Kind, P ; Pimenta dos Santos, M A ; Vacek, V et al.
Geneva : CERN, 2001
Published version from CERN: PDF;
In : 7th Workshop on Electronics for LHC Experiments, Stockholm, Sweden, 10 - 14 Sep 2001, pp.396-400 (CERN-2001-005)
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65.
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TIM (TTC Interface Module) for ATLAS SCT & PIXEL Read Out Electronics
/ Postranecky, M ; Butterworth, J ; Hayes, D ; Lane, J ; Warren, M
CERN, 2001
Published version from CERN: PDF;
In : 7th Workshop on Electronics for LHC Experiments, Stockholm, Sweden, 10 - 14 Sep 2001, pp.222-226 (CERN-2001-005)
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67.
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Development of a Detector Control System for the ATLAS Pixel Detector
/ Kersten, S. (Wuppertal U.) ; Imhauser, M. (Wuppertal U.) ; Imhaeuser, M. (Wuppertal U.) ; Kind, P. (Wuppertal U.) ; Burckhart, H. (CERN) ; Hallgren, B. (CERN) ; Hallewell, G. (Marseille, CPPM) ; Vacek, V. (Prague, Tech. U.)
The innermost part of the ATLAS experiment will be a pixel detector containing around 1750 individual detector modules. A detector control system (DCS) is required to handle thousands of I/O channels with varying characteristics. [...]
physics/0110091; ICALEPCS-2001-THBT002; THBT002; THBT-002.-
Geneva : CERN, 2001 - 3 p.
- Published in : eConf: C011127 (2001) , pp. THBT002
Access to fulltext document: PDF; Fulltext: PDF; External link: Proceedings write-up on eConf
In : 8th International Conference on Accelerator and Large Experimental Physics Control Systems, San José, CA, USA, 27 - 30 Nov 2001, pp.e-proc. THBT002
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72.
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Optical data links for the ATLAS SCT and pixel detector
/ Gregor, I M ; Weidberg, A R ; Lee, S C ; Chu, M L ; Teng, P K
ATLAS (The ATLAS Technical Proposal, CERN/LHCC 94-33) is one of the large electronic particle detectors at LHC (The LHC Conceptual Design, Report-The Yellow Book, CERN/AC/95-05(LHC)) which will become operational in 2005, it is planned to use radiation tolerant optical links for the data transfer from the semiconductor tracker (SCT) (ATLAS Inner Detector Technical Proposal, CERN/LHCC 97-16 and CERN /LHCC 91-17) and pixel detector (ATLAS Pixel Detector Technical Proposal, CERN/LHCC 98-13) systems to the acquisition electronics over a distance up to 140 m. The overall architecture and the performance of these optical data links are described. [...]
2001
- Published in : Nucl. Instrum. Methods Phys. Res., A 465 (2001) 131-4
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75.
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Study of indium bumps for the ATLAS pixel detector
/ Gemme, C ; Fiorello, A M ; Gagliardi, G ; Gilchriese, M G D ; Netchaeva, P ; Rossi, L ; Ruscino, E ; Vernocchi, F ; Varasi, M
The bump-bonding technology is used to join the front-end read-out chips to the silicon substrate of the ATLAS pixel detector. We review the current status of the technology used by Alenia Marconi Systems and we report on the electrical and mechanical properties and the defect rate of the indium bumps. [...]
2001
- Published in : Nucl. Instrum. Methods Phys. Res., A 465 (2001) 200-3
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76.
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Results on 0.7% X0 thick pixel modules for the ATLAS detector
/ Netchaeva, P ; Beccherle, R ; Darbo, G ; Einsweiler, Kevin F ; Gagliardi, G ; Gemme, C ; Gilchriese, M G D ; Oppizzi, P ; Richardson, J ; Rossi, L et al.
Modules are the basic building blocks of the ATLAS pixel detector system, they are made of a silicon sensor tile containing ~46000 pixel cells of 50 mu m*400 mu m, 16 front-end chips connected to the sensor through bump bonding, a kapton flex circuit and the module controller chip. The pixel detector is the first to encounter particles emerging from LHC interactions, minimization of radiation length of pixel modules is therefore very important. [...]
2001
- Published in : Nucl. Instrum. Methods Phys. Res., A 465 (2001) 204-10
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78.
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The ATLAS pixel detector electronics
/ Gagliardi, G
The ATLAS pixel detector readout electronics has been designed to extract the signal of the passage of ionizing particle from over 45000 diodes that form the ATLAS pixel detector module and to cope with both the very high data rate expected in the LHC environment and the trigger requirements in the ATLAS detector. The on-detector electronics must supply early data sparsification and reduction as well as local memory and derandomizing buffers. [...]
2001
- Published in : Nucl. Instrum. Methods Phys. Res., A 466 (2001) 275-81
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87.
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Development of fluorocarbon evaporative cooling recirculators and controls for the ATLAS pixel and semiconductor tracking detectors
/ Bayer, C ; Berry, S ; Bonneau, P ; Bosteels, Michel ; Burckhart, H J ; Cragg, D ; English, R ; Hallewell, G D ; Hallgren, Björn I ; Kersten, S et al.
Geneva : CERN, 2000
Published version from CERN: PDF;
In : 6th Workshop on Electronics for LHC Experiments, Krakow, Poland, 11 - 15 Sep 2000, pp.398-402 (CERN-2000-010)
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90.
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First MCM-D modules for the b-physics layer of the ATLAS Pixel Detector
/ ATLAS Pixel Collaboration
The innermost layer (b-physics layer) of the ATLAS Pixel Detector will consist of modules based on MCM-D technology. Such a module consists of a sensor tile with an active area of 16.4 mm*60.4 mm, 16 read out ICs, each serving 24* 160 pixel unit cells, a module controller chip (MCC), an optical transceiver and the local signal interconnection and power distribution busses. [...]
Geneva : CERN, 2000
- Published in : IEEE Trans. Nucl. Sci. 47 (2000) 745-9
In : IEEE 1999 Medical Imaging Conference, Seattle, WA, USA, 24 - 30 Oct 1999, pp.133-7
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93.
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Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu technology
/ Topper, M ; Dietrich, L ; Engelmann, G ; Fehlberg, S ; Gerlach, P ; Wolf, J ; Ehrmann, O ; Becks, K H ; Reichl, H
The MCM-D which is described here is a prototype for a pixel detector system for the planned Large Hadron Collider (LHC) at CERN, Geneva. The project is within the ATLAS experiment. [...]
1999
- Published in : Proc. SPIE: 3830 (1999) , pp. 295-300
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94.
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Fluorocarbon evaporative cooling developments for the ATLAS pixel and semiconductor tracking detectors
/ Anderssen, E ; Bintinger, D L ; Berry, S ; Bonneau, P ; Bosteels, Michel ; Bouvier, P ; Cragg, D ; English, R ; Godlewski, J ; Górski, B et al.
Heat transfer coefficients 2-5.103 Wm-2K-1 have been measured in a 3.6 mm I.D. [...]
CERN-OPEN-2000-093 ; ATL-INDET-99-016.
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CERN, 1999. - 5 p.
Fulltext - Fulltext - Fulltext - Fulltext - Published version from CERN
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95.
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Radiation hard optical links for the ATLAS SCT and Pixel detectors
/ Charlton, D G ; Dowell, John D ; Homer, R James ; Jovanovic, P ; Kenyon, Ian Richard ; Mahout, G ; Shaylor, H R ; Wilson, J A ; Gregor, I M ; Nickerson, R B et al.
CERN-OPEN-2000-043.-
Geneva : CERN, 2000 - 4 p.
Fulltext: PDF; Published version from CERN: p185 - PDF; p294 - PDF;
In : 5th Conference on Electronics for LHC Experiments, pp.185-188 6th Workshop on Electronics for LHC Experiments, pp.294-298
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97.
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Radiation resistance of the ATLAS pixel sensors
/ D'Auria, S D
This work describes the R and D work on radiation resistant silicon sensors for the ATLAS pixel detector: the technological choices and the design will be illustrated. Some sensor prototypes have been characterised and tested with unirradiated front-end electronics before and after high energy proton irradiation, showing that we can achieve the required radiation resistance to fluences of 1*10/sup 15/ cm/sup -2/ using n/sup +/ on n sensors with the p-spray isolation technology. [...]
1999
- Published in : Nucl. Phys. B, Proc. Suppl. 78 (1999) 639-44
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98.
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Pixel readout chip for the ATLAS experiment
/ Ackers, M ; André, F ; Blanquart, L ; Bonzom, V ; Comes, G ; Fischer, P ; Keil, M ; Kühl, T ; Meuser, S ; Delpierre, P A et al.
Pixel detectors with a high granularity and a very large number of sensitive elements (cells) are a very recent development used for high precision particle detection. At the Large Hadron Collider LHC at CERN (Geneva) a pixel detector with 1.4*10/sup 8/ individual pixel cells is developed for the ATLAS detector. [...]
1999
- Published in : IEEE Trans. Nucl. Sci. 46 (1999) 2033-2038
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99.
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Pixel readout electronics for LHC and biomedical applications
/ Blanquart, L ; Bonzom, V ; Comes, G ; Delpierre, P A ; Fischer, P ; Hausmann, J C ; Keil, M ; Lindner, Manfred ; Meuser, S ; Wermes, N
The demanding requirements for pixel readout electronics for high- energy physics experiments and biomedical applications are reviewed. Some examples of the measured analog performance of prototype chips are given. [...]
2000
- Published in : Nucl. Instrum. Methods Phys. Res., A 439 (2000) 403-12
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101.
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Detailed Studies of the ATLAS Pixel Detectors
/ Troncon, C
/ATLAS Collaboration
Results are reported from beam tests of prototype silicon pixel sensors and front-end electronics with analog readout developed for use in the ATLAS experiment at the Large Hadron Collider (LHC).Both irradiated and unirradiated assemblies were tested for chargecollection, efficiency and position resolution measurements. These indicate that n+ in n silicon pixel detectors with p-spray isolationcan operate after irradiation to fluences of up to 10**15 neq/cm2without significant degradation in performance. [...]
CERN-OPEN-2000-028.-
Geneva : CERN, 2000 - 8 p.
- Published in : IEEE Trans. Nucl. Sci. 47 (2000) 737-44
Access to fulltext document: PDF; IEEE Published version, local copy: PDF;
In : IEEE 1999 Medical Imaging Conference, Seattle, WA, USA, 24 - 30 Oct 1999, pp.125-32
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108.
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On the performance and limitations of a dual threshold discriminator pixel readout circuit for LHC
/ Einsweiler, Kevin F ; Joshi, A ; Marchesini, R ; Pengg, F X ; Zizka, G
The analog frontend of pixel readout electronics with dual threshold discriminator scheme has been measured extensively to determine the conditions for optimum performance as well as the circuits performance limitations. The $9 preamplifier shows a peaking time of 20 ns without capacitive load, which degrades to only 30 ns with a load of 350 fE The LEVEL-discriminator has an adjustable threshold in the range of 2000 to 6000 e/sup -/ with a variable $9 separation to the TIME-discriminator threshold of 800 to 1600e/sup -/. [...]
1999
In : 45th IEEE Nuclear Science Symposium and Medical Imaging Conference, Toronto, Canada, 8 - 14 Nov 1998, pp.237-43 Medical Imaging Conference, Toronto, Canada, 12 - 14 Nov 1998, pp.792-9
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109.
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Dead-time free pixel readout architecture for ATLAS front-end IC
/ Einsweiler, Kevin F ; Joshi, A ; Kleinfelder, S A ; Luo, L ; Marchesini, R ; Milgrome, O ; Pengg, F X
A low power sparse scan readout architecture has been developed for the ATLAS pixel front-end IC. The architecture supports a dual discriminator and extracts the time over threshold (TOT) information along with a 2-D spatial address $9 of the hits associating them with a unique 7-bit beam crossing number. [...]
1999
- Published in : IEEE Trans. Nucl. Sci. 46 (1999) 166-170
In : 45th IEEE Nuclear Science Symposium and Medical Imaging Conference, Toronto, Canada, 8 - 14 Nov 1998, pp.75-79
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110.
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A MCM-D-type module for the ATLAS pixel detector
/ Becks, K H ; Beyne, E ; Ehrmann, O ; Gerlach, P ; Gregor, I M ; Pieters, P ; Topper, M ; Truzzi, C ; Wolf, J
For the ATLAS experiment at the planned Large Hadron Collider LHC at CERN hybrid pixel detectors are being built as innermost layers of the inner tracking detector system. Modules are the basic building blocks of the ATLAS pixel $9 detector. [...]
1999
- Published in : IEEE Trans. Nucl. Sci. 46 (1999) 1861-1864
In : 45th IEEE Nuclear Science Symposium and Medical Imaging Conference, Toronto, Canada, 8 - 14 Nov 1998, pp.38-41
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116.
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ATLAS pixel disk mechanics
/ Anderssen, E ; Bintinger, D L ; Emes, J ; Gilchriese, M G D ; McCormack, F ; Miller, W O
1998
In : International Pixel Detector Workshop - Pixel '98, Batavia, IL, USA, 7 - 9 May 1998, pp.433-453
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117.
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ATLAS pixel detector cooling requirement
/ Budinsky, R ; Hallenell, G ; Lenzen, Georg ; Thadome, J ; Vacek, V
1998
In : International Pixel Detector Workshop - Pixel '98, Batavia, IL, USA, 7 - 9 May 1998, pp.409-432
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119.
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The ATLAS Pixel Project
/ Richardson, John (LBL, Berkeley)
/ATLAS Pixel Collaboration
The ATLAS experiment, at the Large Hadron Collider, will incorporate discrete, high-resolution tracking sub-systems in the form of segmented silicon detectors with 40MHz radiation-hard readout electronics. In the region closest to the pp interaction point, the thin silicon tiles will be segmented into a pixel geometry providing two-dimensional space-point information. [...]
hep-ex/9903035.-
1999 - 7 p.
- Published in : , pp. 12.02
Access to fulltext document: PDF; Fulltext: PDF; External link: hep-ex/9903035 PDF
In : Meeting of the Division of Particles and Fields (DPF) of the American Physical Society (APS), Los Angeles, CA, USA, 6 - 9 Jan 1999, pp.12.02
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125.
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Flex circuits (designs) for the ATLAS pixel detector
/ Skubic, P L ; Boyd, R ; Hennessy, W ; Krishnama, S ; Neriyanuri, K ; Severini, H
1998
In : International Pixel Detector Workshop - Pixel '98, Batavia, IL, USA, 7 - 9 May 1998, pp.519-534
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138.
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It must be hard to stay so close-
<!--HTML-->The ATLAS pixel detector should operate for many years at a few centimeters from the LHC collision region. Every part of the detector should then be radiation hard to levels exceeding 500 KGy [...]
[ATL-ENEWS-2002-015]-
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141.
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A Comparative Study of Reduced Layouts of the ATLAS Inner Detector
/ Barberis, D ; Baines, J T M ; Gavrilenko, I ; Gianotti, F ; Haywood, S ; Luehring, F C ; Pater, J R ; Pickford, A ; Poggioli, Luc ; Poppleton, A et al.
ATL-INDET-97-188 ; ATL-I-PN-188.
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1997.
Access to fulltext document - Access to fulltext document
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142.
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Development of Hybrid and Monolithic Silicon Micropattern Detectors ; 1997 ed.
/ Buis, E J ; Alberigi, A ; André, F ; Antinori, Federico ; Barberis, D ; Bates, R ; Batignani, G ; Becker, C ; Becks, K H ; Beker, H et al.
1997
- Published in : Experim. CERN (1997) , pp. 392-395
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147.
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Bier and Pastis, a pixel readout prototype chip for LHC
/ Berg, C ; Blanquart, L ; Bonzom, V ; Delpierre, P A ; Desch, Klaus ; Fischer, P ; Keil, M ; Meuser, S ; Raith, B A ; Wermes, N
The 12*63 pixel readout prototype chip Bieu&Pastis;, designed to cope with the environment imposed on a pixel detector by high-energy proton-proton collisions as expected at the Large Hadron Collider (LHC), is described. The chip contains the full pixel cell functionality, but not yet the full peripheral architecture for data transfer and readout with LHC speed. [...]
2000
- Published in : Nucl. Instrum. Methods Phys. Res., A 439 (2000) 80-90
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148.
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Performance of ATLAS pixel prototype chips
/ Bonzom, V ; Blanquart, L ; Delpierre, P A ; Fischer, P ; Meuser, S ; Wermes, N
1997
In : 3rd Workshop on Electronics for LHC Experiments, London, UK, 22 - 26 Sep 1997, pp.202 (no paper submitted)
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