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RD53 Papers

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RD53B users guide /RD53 Collaboration
Introduction to RD53B pixel chip architecture, features, performance and recommendations for use in pixel detector systems
CERN-RD53-PUB-21-001.- Geneva : CERN, 2020 Fulltext: PDF;

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CMS analog front-end: simulations and measurements / Gaioni, Luigi (Universita and INFN (IT)) ; Gaioni, Luigi (Universita and INFN (IT)) ; Loddo, Flavio (Universita e INFN, Bari (IT)) /RD53 collaboration
Simulations and measurements of the Linear analogue front-end used in the RD53B-CMS (CROC) pixel chip. Lots of useful information when having to optimize Analog front-end configuration to specific pixel sensor and specific operation conditions
CERN-RD53-PUB-20-002.- Geneva : CERN, 2020 - 100. Design, simulation and test of Linear Analog Front-end: PDF;

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DRAD results obtained during irradiation campaigns / Jara Casas, Luis Miguel (CERN) /RD53 Collaboration
The DRAD chip was designed with the aim of studying the impact of high radiation levels on digital electronics in 65nm CMOS technology, A description of the chip and a summary of the results obtained in the testing is shown in this document. Results cover campaigns after irradiation up to total ionizing doses of 200 Mrad and 500 Mrad at different temperatures. [...]
CERN-RD53-PUB-20-001.- Geneva : CERN, 2020 - 210. DRAD chip test results report: PDF; Results of the LPGBT test structure, 200Mrad -20C:: PDF; Results of the LPGBT test structure, 200Mrad room temperature: PDF; Results of the LPGBT test structure, 500Mrad room temperature: PDF;

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RD53B Manual / Garcia-Sciveres, Maurice (Lawrence Berkeley National Lab. (US)) ; Loddo, Flavio (Universita e INFN, Bari (IT)) ; Christiansen, Jorgen (CERN) /RD53 collaboration
Detalied description ifthe RD53B design applicable to both ATLAS and CMS submissions. Also GDS files of top metal of submitted chips
CERN-RD53-PUB-19-002.- Geneva : CERN, 2019 - 100. - Published in : 1) Detailed_ATLAS_Manual_pdf_from_gitlab
- Published in : 2) Detailed_CMS_Manual_pdf_from_gitlab
- Published in : 3) General_introductory_guide RD53B_ATLAS_top_metal_Final: GZ; RD53B_CMS_top_metal_V1: ZIP;

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RD53B Design Requirements / Garcia-Sciveres, Maurice (Lawrence Berkeley National Lab. (US)) /RD53 Collaboration
Common requirements for the ATLAS and CMS HL-LHC pixel readout chips. A common design framework called RD53B will be used to generate the production chip layouts for both experiments, with minor customization affecting primarily the chip size, which will be different for ATLAS and CMS, but is simply a parameter in the RD53B framework [...]
CERN-RD53-PUB-19-001.- Geneva : CERN, 2019 - 16. - Published in : RD53B_Requirements_V3_1: PDF;

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Production chip combined requirements for ATLAS and CMS / Garcia-Sciveres, Maurice (University of California Berkeley (US)) /RD53 Collaboration
Draft for comment by the CMS collaboration
CERN-RD53-PUB-18-002.- Geneva : CERN, 2018 for review by experiments: PDF;

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Production chip combined requirements for ATLAS and CMS / Garcia-Sciveres, Maurice (University of California Berkeley (US)) /RD53 Collaboration
Requirements draft for comment by ATLAS Collaboration
CERN-RD53-PUB-18-001.- Geneva : CERN, 2018 - 20. (for review by experiments): PDF;

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The RD53A Integrated Circuit / Garcia-Sciveres, Maurice (Lawrence Berkeley National Lab. (US)) /RD53 Collaboration
Implementation details for the RD53A pixel readout integrated circuit designed by the RD53 Collaboration. This is a companion to the specifications document and will eventually become a reference for chip users. [...]
CERN-RD53-PUB-17-001.- Geneva : CERN, 2017 - 73. RD53A_Manual_V3-51: PDF;

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RD53A Integrated Circuit Specifications / Garcia-Sciveres, Mauricio (Lawrence Berkeley National Lab. (US)) /RD53 Collaboration
Specifications for the RD53 collaboration’s first engineering wafer run of an integrated circuit (IC) for hybrid pixel detector readout, called RD53A. RD53A is intended to demonstrate in a large format IC the suitability of the technology (including radiation tolerance), the stable low threshold operation, and the high hit and trigger rate capabilities, required for HL-LHC upgrades of ATLAS and CMS. [...]
CERN-RD53-PUB-15-001.- Geneva : CERN, 2015 - 18. GDS file: GDS; RD53A chip specifications: PDF; Surface features: PDF; read me : TXT;

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The RD53 Collaboration's SystemVerilog-UVM Simulation Framework and its General Applicability to Design of Advanced Pixel Readout Chips / Marconi, S. (CERN ; INFN, Perugia ; Perugia U.) ; Conti, E. (Perugia U. ; INFN, Padua) ; Placidi, P. (Perugia U. ; INFN, Perugia) ; Christiansen, J. (CERN) ; Hemperek, T. (Bonn U.)
The foreseen Phase 2 pixel upgrades at the LHC have very challenging requirements for the design of hybrid pixel readout chips. A versatile pixel simulation platform is as an essential development tool for the design, verification and optimization of both the system architecture and the pixel chip building blocks (Intellectual Properties, IPs). [...]
CERN-RD53-PUB-14-001; arXiv:1408.3232.- Geneva : CERN, 2014 - 15 p. - Published in : JINST 9 (2014) P10005 Fulltext: arXiv:1408.3232 - PDF; AIDA-PUB-2014-019 - PDF; IOP Open Access article: PDF; External link: Preprint

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