| Article | |
| Title | Design of the ATLAS Inner Tracker (ITk) upgrade pixel module quad flex PCB |
| Author(s) | Naik, S (Glasgow U.) ; Bates, R (Glasgow U.) |
| Collaboration | ATLAS ITK Collaboration |
| Publication | 2026 |
| Number of pages | 9 |
| In: | JINST 21 (2026) C04043 |
| In: | Topical Workshop on Electronics for Particle Physics 2025, Rethymno, Crete, Greece, 6 - 10 Oct 2025, pp.C04043 |
| DOI | 10.1088/1748-0221/21/04/C04043 |
| Subject category | Detectors and Experimental Techniques |
| Accelerator/Facility, Experiment | CERN LHC ; ATLAS |
| Abstract | The ITk pixel detector consists of “quad” and “triplet” modules with the triplet being used in the innermost layer L0 and quads used in layers L1-L4. The detector primarily consists of 10,000 planar quad module, formed from 4 chips, (developed within the RD53collaboration) bump bonded to a single sensor operated in serial power chains. The flex attached to the sensor connects the chips to the system and provides module electrical environment including power, data, clock and command (CMD) while fulfilling the mechanical specifications. The flex must provide signal transmission at 1.28 Gbps, and a power domain that minimizes voltage drops. It must be low material to reduce radiation length and stress in the module bump bonds due to CTE (Coefficient of Thermal Expansion) mismatch within the module. This paper presents the design and design validation of the quad flex. |
| Copyright/License | publication: © 2026 The author(s) (License: CC-BY-4.0) |
Corresponding record in: Inspire
Záznam vytvorený 2026-04-22, zmenený 2026-04-22
